The Illinois Plasma Institute and Research (IPI) is pleased to announce that graduate student Christian Williams has successfully defended his PhD thesis, marking a significant milestone for both the institute and the broader field of sustainable semiconductor manufacturing.
Christian’s dissertation addresses one of the emerging challenges in chip fabrication: the accumulation of difficult-to-remove residues that result from evolving photoresist chemistries and material stacks. As the semiconductor industry continues to advance lithographic and etch technologies, the chemical cleaning steps required to maintain device yield have grown increasingly complex, and increasingly reliant on hazardous chemical formulations.
“In the pursuit of environmentally friendly solutions to current semiconductor cleaning technologies, atmospheric pressure plasmas may be a suitable alternative.”
Christian’s work demonstrates the potential of plasma-activated water (PAW) as a viable alternative to conventional solutions based on tetramethyl ammonium hydroxide (TMAH) and ammonium hydroxide (NH₄OH). Through systematic control experiments, he showed that TiO₂ residue removal,a key cleaning challenge, responds distinctly to peroxide and nitrate species, the two primary reactive components generated when plasma is used to treat liquid media.
Building on this chemical foundation, Christian developed process margins using a DC pin-to-liquid system to achieve targeted species concentrations. In a final set of experiments, he applied an atmospheric pressure plasma directly above a TiO₂-coated wafer submerged in an electrolyte solution, achieving removal rates comparable to the best-performing chemical formulations, without the use of hazardous chemicals.
These findings open a promising path toward greener semiconductor cleaning processes and underscore IPI’s commitment to translating fundamental plasma science into real-world industrial impact. We congratulate Christian on this outstanding achievement and wish him continued success in his career.





